RDL Adhesion Strength Measurement Project
Presentation from the Call-for-Participation Webinar (March 2 & 3, 2021)
Statement of Work and Project Statement
BackgroundRDL (redistributed layer) adhesion for advanced substrates, fan-out wafer level packaging (FO-WLP) and panel level packaging (PLP) is critical for packaging lifetime quality. Poor adhesion strength can lead to circuit patterning quality and package reliability issues. RDL is exposed to the manufacturing process environment, which may cause degradation in the adhesion to other materials, such as the encapsulant, insulation, die, carrier wafer, substrate, panel, etc.
Currently, there is no global standard to measure narrow (20µm and below) RDL adhesion strength. The only available measurement standard is an IPC standard that is for wider Cu trace adhesion to printed circuit boards. It is critical for the industry to have a means to identify potential quality risks due to insufficient adhesion strength.
Purpose of Project
The objective of the RDL Adhesion Strength Measurement project is to evaluate adhesion strength measurement methodologies and characterize RDL mechanical performances. The project will also establish potential common requirements for key material properties so that packaging companies and users have identical qualification requirements.
Steps for Joining the ProjectPlease note: iNEMI membership is required to participate in this project.
For iNEMI members:
Complete and sign the project statement and email to firstname.lastname@example.org