Recent Trends of Package Warpage Characteristic


Wei Keat Loh, Intel


Wei Keat Loh, Intel

Ron Kulterman, Flextronics

Tim Purdie, Akrometrix LLC

Haley Fu, iNEMI

Masahiro Tsuriya, iNEMI


Dynamic warpage trends for package-on-package and its memory, plastic ball grid array and flipped chip ball grid array packages are presented to provide an overview of current industry trends of package warpage. The effect of bake and manufacturing exposure time on package dynamic warpage and the challenges in quantifying shape will be discussed and recommended for future package warpage characterization. (Presented at the 2015 ICEP conference in Kyoto, Japan.)

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