Conference Presentation
Presenter:
Wei Keat Loh, Intel
Authors:
Wei Keat Loh, Intel
Ron Kulterman, Flextronics
Tim Purdie, Akrometrix LLC
Haley Fu, iNEMI
Masahiro Tsuriya, iNEMI
Description:
Dynamic warpage trends for package-on-package and its memory, plastic ball grid array and flipped chip ball grid array packages are presented to provide an overview of current industry trends of package warpage. The effect of bake and manufacturing exposure time on package dynamic warpage and the challenges in quantifying shape will be discussed and recommended for future package warpage characterization. (Presented at the 2015 ICEP conference in Kyoto, Japan.)
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