Tuesday, October 1, 6:00-8:00 p.m, Room #207. Held in conjunction with the 2019 iMAPS International Symposium in Microelectronics Hynes Convention Center / Boston
Please join iNEMI/IMAPS and a group of industry experts to discuss future solutions in the areas of design and test infrastructures for system-in-package (SiP) and advanced packages. This “brainstorming” session is in response to the interest among panelists and the audience at the IMAPS Advanced SiP panel session held in Monterey, California this past June.
Attendance is free. Please register to help with our planning.
If you have any questions or need additional information, please contact Urmi Ray (email@example.com).