Our Resources

iNEMI Newsletters — Quarterly

iNEMI Newsletters — Monthly

Conference & Workshop Presentations

Presentations from the iNEMI/SMTA Technical Webinar Series (2020)

iNEMI PCB Roadmap Overview, presented by Steve Payne (iNEMI), EIPC’s 2020 Winter Conference (February 13; Rotterdam, The Netherlands)

iNEMI Presentations from SMTA Pan Pacific Microelectronics Symposium (February 12; Big Island, Hawaii)

iNEMI PCB Technology Forum at APEX: Emerging Challenges and Technology Needs plus additional conference technical presentations, IPC APEX EXPO 2020 (February 4 & 5; San Diego, California)

iNEMI Connector Reliability Test Recommendations Project, presented by Vince Pascucci (TE Connectivity), IPC Wisdom Wednesday Webinar (December 18, 2019)

iNEMI Panel Session at EPTC: Packaging Challenges & Opportunities for 5G Applications (Electronics Packaging Technology Conference; December 4, 2019; Singapore)

Articles / Interviews / Press Releases

IPC and iNEMI Sign Memorandum of Understanding, Strengthening Collaboration Focused on
the Future of Electronics Manufacturing (August 3, 2020)

iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19 (July 24, 2020)

The Future Of Manufacturing Is (Almost) Here, Dan Gamota (Jabil), Forbes online, July 16, 2020

IoT Suffers from a Lack of Standards: What the electronics industry must do to change that, Joanne Friedman (Connektedminds) and Barbara Goldstein (NIST), Printed Circuit Design & Fab/Circuits Assembly, July 2020, pp 30-31

Intel's Mostafa Aghazadeh Elected Chairman of iNEMI Board (July 7, 2020)

Can Tomorrow’s A&D Designs Handle the Heat? Peter M. Carter (Aeromarc LLC), Printed Circuit Design & Fabrication/Circuits Assembly, April 2020, p 68

iNEMI CEO Marc Benowitz, interview with REALTIME with IPC APEX EXPO, February 2020

Grace O’Malley (iNEMI) interview with REALTIME with IPC APEX EXPO, February 2020

Can PCB Fabrication Processes Keep Up with Design Demands? Steve Payne (iNEMI), Printed Circuit Design & Manufacturing/Circuits Assembly online, February 2020

Digital Building Blocks: AI and Machine Learning Will Shape the Coming Era of Electronics Manufacturing, Dan Gamota (Jabil) Printed Circuit Design & Fabrication/Circuits Assembly, December 2019

Project Webinars & Reports

iNEMI New Package/Material Qualification Methodology Project Summary Report, Public Version (v1.0, June 22, 2020)

Presentations from the iNEMI/SMTA Technical Webinar Series (2020)

iNEMI Project is Analyzing Inspection Capabilities for Fine Pitch Substrates (iNEMI blog, March 26, 2020)

End-of-Project/Phase 2 and Call-for-Participant/Phase 3 Webinar, Wafer/Panel Level Fine Pitch Inspection/Metrology project (March 5, 2020)

Sustainable Electronics— Information Webinar on Lack of Harmonization in Materials Regulations and Inefficiencies in Data Collection, March 4, 2020 (available to public)

New Package/Material Qualification Methodology end-of-project webinar presentation, February 19, 2020

Sustainable Electronics Technical Plan, February 19, 2020 (members only; requires log-in)
Report Webinar presentation

2020 Packaging Technical Plan — Packaging Technology Challenges and Recommendations, February 12, 2020 (members only; requires log-in)
Report Webinar presentation

1st Level Interconnect Void Characterization Project call-for-participation webinar presentation, December 12, 2019

Roadmap Presentations

iNEMI Roadmap Highlights Webinar Series Presentations

Our Resources

iNEMI Newsletters — Quarterly

iNEMI Newsletters — Monthly

Conference & Workshop Presentations

Articles / Interviews / Press Releases

Project Webinars & Reports

Roadmap Presentations

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