solar-lab_1.jpg

 

Amphenal white space 2

Untitled design (7)

Cimetrix

 

Dartmouth (1)

Untitled design (2)-1

Untitled design (8)-2

hp

IBM

Untitled design (6)

NREL_logo

Untitled design (10)

Untitled design (1)

Untitled design (11)

Sekisui

Sheldahl

Tamura

Untitled design (12)

Untitled design

Untitled design (52)

yxlong_inemi

Zestron

 

iNEMI Newsletters — Monthly

Conference & Workshop Presentations

Low Temperature Solder: Enabling the Future, Kevin Byrd (Intel Corporation), iNEMI/SMTA Technical Webinar Series, Tuesday, May 19, 2020.

iNEMI PCB Roadmap Overview, presented by Steve Payne (iNEMI), EIPC’s 2020 Winter Conference (February 13; Rotterdam, The Netherlands)

iNEMI PCB Technology Forum at APEX: Emerging Challenges and Technology Needs plus additional conference technical presentations, IPC APEX EXPO 2020 (February 4 & 5; San Diego, California) 

iNEMI Connector Reliability Test Recommendations Project, presented by Vince Pascucci (TE Connectivity), IPC Wisdom Wednesday Webinar (December 18, 2019)

iNEMI Panel Session at EPTC: Packaging Challenges & Opportunities for 5G Applications (Electronics Packaging Technology Conference; December 4, 2019; Singapore) 

Articles & Interviews

Can Tomorrow’s A&D Designs Handle the Heat? Peter M. Carter (Aeromarc LLC), Printed Circuit Design & Fabrication/Circuits Assembly, April 2020, p 68

iNEMI CEO Marc Benowitz, interview with REALTIME with IPC APEX EXPO, February 2020

Grace O’Malley (iNEMI) interview with REALTIME with IPC APEX EXPO, February 2020

Can PCB Fabrication Processes Keep Up with Design Demands? Steve Payne (iNEMI), Printed Circuit Design & Manufacturing/Circuits Assembly online, February 2020

Digital Building Blocks: AI and Machine Learning Will Shape the Coming Era of Electronics Manufacturing, Dan Gamota (Jabil) Printed Circuit Design & Fabrication/Circuits Assembly, December 2019

Project Webinars & Reports

End-of-Project/Phase 2 and Call-for-Participant/Phase 3 Webinar, Wafer/Panel Level Fine Pitch Inspection/Metrology project (March 5, 2020)

Sustainable Electronics— Information Webinar on Lack of Harmonization in Materials Regulations and Inefficiencies in Data Collection, March 4, 2020 (available to public)

Sustainable Electronics Technical Plan, February 19, 2020 (members only; requires log-in)    
       
Report    Webinar presentation 

2020 Packaging Technical Plan — Packaging Technology Challenges and Recommendations, February 12, 2020 (members only; requires log-in)    
        Report    Webinar presentation