Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards. This trend has led to warpage issues in the surface mount assembly process which, in turn, impacts PCB assembly yield. iNEMI is organizing a project that will help to explore three key factors (PCB fabrication process, PCB design and board assembly process conditions) and develop guidelines for each of these factors to help minimize PCB warpage and improve SMT margin/yield.
This project was organized to assess measurement and inspection capabilities for fine circuit pattern substrates used in high-bandwidth applications. Phase 1 benchmarked the metrology for fine pitch design on panel-sized areas, and the results were discussed in this end-of-project webinar.
This end-of-project webinar, held October 28, 2016, reviews the project team’s analysis of the four metrologies used to characterize, measure and present the dynamic warpage of electronic packages as a function of temperature. Their intent was not to declare a best tool but, rather, to provide comparative aspects across the metrologies and tools for those considering a specific use model.
The end-of-project webinar for the DC-DC Power Module Project reviewed results of the project team’s work to design and test prototypes of a DC-DC converter to prove out the electrical and mechanical engineering specification requirements developed during Phase 1.
iNEMI’s PCBA Reliability Qualification Project developed the requirements outlined in this document for the assembly-reliability qualification of printed circuit board assemblies (PCBAs) used in enterprise products. The recommendations establish a common hardware reliability qualification process for computing hardware, and may be used to qualify new aspects of manufacturing and design such as new manufacturing facilities, changes in materials, process, and new design elements.
The Lead-Free Rework Optimization Project used the rework processes developed by previous phases to assemble and rework boards and perform reliability testing to validate the rework processes developed. Part 2 of the end-of-project presentation discusses the results of rework for adjacent components, BGA sockets, mini-pots, PDIPs, and DIMMs.
This paper by the Metals recycling Project discusses the state of metals recovery and recycling in the electronics industry.
This paper reports on the findings of the Recycling and Repair Metrics Project’s assessment of the type and quality of metrics available to the electronics industry for measuring an electronic product’s true recyclability, reusability, repairability and refurbish-ability. It also looks at whether existing metrics are adequate to meet the needs of the industry and makes recommendations for changes and further study.
Part 1 of the end-of-project presentation of the Lead-Free Rework Optimization Project covers solder joint characterization and reliability. The project evaluated and recommended best practices, rework equipment requirements, impact of adjacent component temperatures and procedures for best practice lead-free rework processing. This presentation discusses details of the accelerated thermal cycling (ATC) test results plus solder joint and plated through hole (pth) copper knee thickness characterization
The Component Specifications for Medical Products Project addressed the lack of industry-wide medical specifications for the qualification of components or their suppliers. This report summarizes the work conducted by this iNEMI project team to identify relevant critical components and then, using a case study of a specific critical component, to assess the level of understanding and technical knowledge needed to develop a relevant specification for that component that would be appropriate for medical devices.
The Alternative Material Assessment Project’s suggested framework for alternative material evaluation is discussed in this report. It also reviews assessment tools identified in the Organisation for Economic Cooperation and Development (OECD) Toolbox versus a set of benchmarking characteristics the team identified as necessary for conducting an alternative material assessment.