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SMTA International 2019
September 22-26
Rosemont, Illinois USA



The papers listed below were originally published in the SMTA International Conference Proceedings 2019 and are included here with permission from SMTA.



Thursday, September 26 

Session LF 1 - Lead-Free Reliability Challenges 
Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys
Presenter: Richard Coyle (Nokia Bell Labs)  
download:  
paper    


Session MFX 7 - Cleaning Challenges
Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies — iNEMI Cleanliness Research Study
Presenter: Mike Bixenman (KYZEN Corporation)
download:  paper        download:  presentation


Session LF 3 - Low Temperature Solder
iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part VI: Post Mechanical Shock Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components
Presenter: Raiyo Aspandiar (Intel Corporation)
download:   paper    presentation