|Board assembly is a critical part of the overall electronic products supply chain. It accounts for most of the direct material cost and is closely associated with component packaging, interconnection, inspection, thermal management, final assembly, and environmental compliance. This chapter identifies four primary drivers for development in board assembly processes:
• Conversion cost reduction
• Reduction in new product introduction time
• Increased component I/O density
• Transition to environmental and regulatory requirements
The 2019 Board Assembly chapter discusses the board assembly process, which includes leaded component insertion (for wave soldering) and/or solder paste application for surface mount technology (SMT) on the bare printed circuit board and ends at printed circuit board assembly test. It also includes special processes such as underfill application, odd form component placement, etc. Although test and inspection actions occur throughout the board assembly process, they are not addressed specifically in this chapter.
Sections within this chapter focus on several sub-areas within the board assembly process. These are: new product introduction, assembly materials, SMT, placement, dispense technology, wave and selective soldering, press fit, rework, and direct chip attach.