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UL Webinar Series
Update on UL LTTA Improvement Efforts for PCBs/PCBA, webinar presented by Crystal Vanderpan (UL) (April 2, 2014)
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Upcoming Events
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12Sep
Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity
10:30 AM to 11:30 AM EDT
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17Sep
iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders
10:00 AM to 11:00 AM JST
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17Sep
Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives
11:00 AM to 12:00 PM EDT
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19Sep
Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education
11:00 AM to 12:00 PM EDT
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24Sep
Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering
10:00 AM to 11:00 AM JST