Wafer/Panel Level Package Flowability and Warpage

Project Leader:
Renn Chan Ooi, Intel Corporation

Project Co-Leader:
Tanja Braun, Fraunhofer IZM


End-of-Project Webinar

Presentation: Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar (April 8 & 16, 2020)

Statement of Work and Project Statement


Wafer Level Packaging (WLP) and the movement to Panel Level Packaging (PLP) have gained industry attention as more cost-effective packaging technologies for certain applications.  In both cases the molding poses technical challenges in terms of understanding the optimum mold compound behavior in terms of flowability and warpage aspects, in order to limit process failure. The increased size adaptation (wafer size above 300mm or panel larger than 300mmx300mm) expands the assembly molding challenges even further. A greater understanding is needed about the flowability fundamentals of mold compounds and their impacts on quality and, potentially, warpage of the wafer/panel for subsequent processes.‚Äč

Project Objectives 

This project will:
  • Identify key processing factors that impact flowability
  • Establish factors from flowability that impact warpage
  • Identify other material factors that impact post mold warpage to achieve higher yield in flow and warpage control for mold first WLP/PLP assembly processes.


“Numerical and Experimental Studies on Warpage of Flat Panel Packages,” presented by Franco Costa (Autodesk), SPE ANTEC 2021, May 17 (virtual event). Available to members only:   paper          presentation

Experimental Study of Panel Level Packaging Warpage, presented by Diane Ecoiffier (Insidix France), Electronics System-Integration Technology Conference (ESTC) 2020 virtual conference (September 15-18, 2020).    paper   presentation
Call-for-participation webinar (March 8, 2018) 

For Additional Information

Haley Fu, haley.fu@inemi.org