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Call-for-Participation Presentation: PCB Warpage Characterization and Minimization Project

This new iNEMI project plans to:
  • Evaluate PCB warpage on board with thickness ≤ 0.8mm (32mil)
  • Evaluate PCB warpage and local area of interest (BGA, shield) in PCB
  • Generate guidelines of PCB fabrication processes to minimize PCB warpage
  • Generate guidelines of PCB design factors to minimize PCB warpage
  • Generate guidelines of reflow pallet design factors to minimize PCB warpage
The presentation from the call-for-participation webinar, held June 14 & 15, 2017 is available here and includes a link to the recorded session. The webinar reviews project background, scope and plan, and explains sign-up steps to join the project. 

The deadline for project sign-up is July 15. Click here for additional project information, including Statement of Work.

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