Call-for-Participation Presentation: PCB Warpage Characterization and Minimization Project
This new iNEMI project plans to:
Evaluate PCB warpage on board with thickness ≤ 0.8mm (32mil)
Evaluate PCB warpage and local area of interest (BGA, shield) in PCB
Generate guidelines of PCB fabrication processes to minimize PCB warpage
Generate guidelines of PCB design factors to minimize PCB warpage
Generate guidelines of reflow pallet design factors to minimize PCB warpage
The presentation from the call-for-participation webinar, held June 14 & 15, 2017 is available here and includes a link to the recorded session. The webinar reviews project background, scope and plan, and explains sign-up steps to join the project.
The deadline for project sign-up is July 15. Click here for additional project information, including Statement of Work.