This end-of-project webinar discussed the project achievements of Phase 3 of the Warpage Characteristics of Organic Packages Project. The project team analyzed the four metrologies used to characterize, measure and present the dynamic warpage of electronic packages as a function of temperature: shadow moiré, digital fringe projection, confocal and digital image correlation.
A series of identical measurement scenarios was applied to each metrology in an attempt to establish constructive comparisons of capability and use across specific tools commonly used for today. Key parameters targeted in these evaluations included field of view (FOV), oven capabilities, measurement preparation and software capabilities. The intent was not to declare a best tool but, rather, to provide comparative aspects across the metrologies and tools for those considering a specific use model.
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