Follow-up Webinar to Substrate & Package Technology Workshop

This webinar is a follow-up to the iNEMI Substrate & Package Technology Workshop:  Road to Integrated SiP Package Technology Innovation, hosted by IBM in Singapore (May 26-27, 2016).
Presentation (July 13, 2016)

Recording of webinar (July 13, 2016).  (This link is for iNEMI members only.  If you are an iNEMI member, please log into your account or create a web account to view.)\

Workshop (May 26-27, 2016)

Further Information
Mashiro Tsuriya