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Project Webinars and Reports
Project Webinars
These webinars are for iNEMI members only (unless otherwise noted)
Ultra Low Loss Laminate/PCB for High Reliability and Performance End-of-Project Webinar (March 7/8, 2017)Connector Reliability Test Recommendations End-of-Project Webinar (April 6-7, 2016)
Automotive Electronic Material Challenges End-of-Project Webinar. Recording (35 mins) (March 17, 2016) (available to both members and non-members)
Metals Recycling (August 27, 2015) (available to both members and non-members)
Alternative Materials Assessment End-of-Project Webinar, also paper and benchmarking of tools (August 25, 2015) (available to both members and non-members)
Recent Trends of Package Warpage Characteristics, iNEMI Warpage Characterization Project Phase 2 Completion Webinar (May 22, 2015)
Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability, Phase 1 (May 20, 2015)
Qualification Test for Creep Corrosion in Flowers of Sulfur Chamber, Phase 2 End-of-Project Webinar (May 11, 2015)
DC-DC Power Module, Phase 1 End-of-Project Webinar, presented by David Mohr (HP) (October 30, 2014)
Assessment of Reliability Standards and Test Methods for Implantable Medical Devices (July 23, 2014)
Metals Recycling (July 8, 2014)
Boundary Scan, Phase 2 (May 7, 2014)
Built-In Self-Test (BIST), Phase 3 (May 7, 2014)
Qualification Test Development for Creep Corrosion, Phase 1 (April 21, 2014)
Copper Wire Bonding, Phase 2 (March 27, 2014)
Qualification Methods for Portable Medical Products (March 27, 2014)
Component Specifications for Medical Products (March 25, 2014)
Improving UL Certification of Laminates and Printed Circuit Boards (November 20, 2013)
Counterfeit Components (October 15, 2013)
Wiring Density for Organic Packaging Substrates (December 6, 2012)
Connector Particle Thickness Investigation (December 4, 2012)
Creep Corrosion, Phase 3 (November 5-6, 2012)
Eco-Impact Evaluator, Phase 2 (LCA Estimator for ICT Products) (October 17, 2012)
HFR-Free High Reliability PCB Project (October 4, 2012)
Structural Test of External Memory Devices (Boundary Scan Adoption Project, Phase 2) (May 24, 2012)
HFR-Free PCB Materials (February 21, 2012)
Board Coplanarty in SMT (August 23, 2011)
Board Flexure Standardization (August 4-5, 2011)
Eco-Impact Evaluator for ICT Equipment (December 3, 2010)
Pb-Free Wave Soldering, Phase 2 (October 14, 2010)
Solder Paste Deposition, Phase 1 (October 13-14, 2010)
Built-In Self-Test (BIST), Phase 1 (July 14 2010)
Board Flexure Standardization Project (January 20, 2010)
Boundary Scan Adoption Project (October 20, 2009)
Functional Test Coverage Assessment (August 12, 2009)
iNEMI Lead-Free Rework Optimization, Phases 1 and 2 (August 5, 2009)
Tin Whisker Accelerated Test Project Phases 1-5 (June 10, 2009)
Fiber Connector Endface Inspection Project Phase 2 (March 23, 2009)
Nano-Solder Project (February 4, 2009)
Nano-Attach Project (December 17, 2008)
Medical Components Reliability Specifications Project (November 6, 2008)
BFR-Free PCB Material Evaluation Project (September 17, 2008)
Pb-Free BGAs in SnPb Assembly Process Project (October 4, 2007)
Pb-Free Wave Soldering Project Phase 1 (October 4, 2007)
Fiber Connector End-Face Inspection (January 24, 2007)
Materials Composition Data Exchange Project (December 8, 2005)
Lead-Free Assembly & Rework Project (April 4, 2005)
DPMO Project (February 16, 2005)
Final Reports
These webinars are for iNEMI members only (unless otherwise noted)
Evaluation of Pb-Free Component & Board Finish Reliability (December 19, 2012)
PVC Alternatives Project, Phase 1 Final Project Team Report (September 12, 2011)
PVC Alternatives Project, Phase 1 Final Project Team Report (September 12, 2011)
PVC Alternatives Interim Report (November 30, 2010)
iNEMI Tin Whisker Team End-of-Program Report, Richard Parker (Delphi), presented at iNEMI Fall Council meeting (October 28, 2010; Orlando, Florida)
Rare Earth Metals Survey Summary (August 23, 2010)
iNEMI Whitepaper on Life Cycle Assessment (LCA) for the Information and Communications Technologies (ICT) Sector (April 2010)
Nano-Attach Project (September 4, 2008)
Nano-Attach Project (September 4, 2008)
BFR-Free PCB Project, Phase II (Material Evaluation) (August 8, 2008)
Pb-Free BGAs in SnPb Assembly Process Project (August 28, 2008)
2006 iNEMI Optoelectronic Substrates Project Report (November 2, 2006)
Lead-Free Assembly & Rework Project (June 2005)
Lead-Free Assembly Project (December 2003)