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Our Members

  • 3M
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  • Amphenol
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  • CALCE (Center for Advanced Life Cycle Engineering)
  • Celanese International Corporation
  • Celestica
  • Centro Ricerche FIAT S.C.p.A
  • Cimetrix
  • CoreTech System Co., Ltd. (Moldex3D)
  • Dartmouth College
  • Dell, Inc.
  • DELO Industrial Adhesives
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  • Foxconn Interconnect Technology, Ltd.
  • Fraunhofer IZM
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  • IBIDEN CO., LTD.
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  • Integrated Micro-Electronics Inc. (IMI)
  • Intel Corporation
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  • Isola Corp.
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  • Keysight Technologies, Inc.
  • Korea Advanced Institute of Science & Technology (KAIST)
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  • Lotes Co. Ltd.
  • MacDermid Alpha Electronics Solutions
  • MIT Microphotonics
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  • Microsoft
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  • National Institute of Standards and Technology (NIST)
  • Nihon Superior Co., Ltd.
  • Nokia
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  • Picosun, an Applied Materials Company
  • Power Sources Manufacturers Association (PSMA)
  • Purdue University
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  • Resolute Photonics
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  • SEMI
  • Senju Comtek/Senju Metal Industry Co.
  • Senko Advanced Components
  • Shengyi Technology (SYTECH)
  • Shinko Electric Industries
  • Resonac (Showa Denko)
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  • Suzhou Eunow Co. Ltd.
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  • Home
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Whitepapers & Position Statements

iNEMI White Paper on Development of a Methodology to Determine Risk of Counterfeit Use (October 2013)
iNEMI White Paper on Harmonization of Environmental Data Management (December 2012) 
iNEMI White Paper on PVC Alternatives (December 2012)
iNEMI Position Statement on the Limits of Temperature, Humidity and Gaseous Contamination in Data Centers and Telecommunication Rooms to Avoid Creep Corrosion on Printed Circuit Boards (April 2012)
iNEMI Product Carbon Footprint (PCF) Position Statement (October 2010) 
iNEMI Whitepaper on Lifecycle Assessment (April 2010) 
iNEMI Timeline for HFR-Free Electronics & PVC-Free Cabling (February 27, 2010) 
iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)
 


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Upcoming Events

  • 5
    Apr
    Sustainable Electronics TIG: New Circular Economy Standards (members only)

    11:00 AM to 12:00 PM EDT

  • 13
    Apr
    Call for Participation: Low-Temp Material Characterization for 1st Level Interconnect - Session 2

    9:00 AM to 10:00 AM EDT

  • 13
    Apr
    Call for Participation: Low-Temp Material Characterization for 1st Level Interconnect - Session 1

    10:00 AM to 11:00 AM JST

  • 19
    Apr
    iNEMI Session at ICEP 2023

    9:30 AM to 11:15 AM JST

  • 19
    Apr
    Eco-Impact Estimator Planning Meetings

    11:00 AM to 12:00 PM EDT

View All Events

International Electronics Manufacturing Initiative
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Morrisville, North Carolina  27560  United States
(984) 333-0820

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