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Our Members

  • 3M
  • AGC Multi Materials
  • Ajinomoto Fine Techno
  • Akrometrix, LLC
  • Amphenol
  • Applied Materials
  • ASMPT Limited
  • AT&S
  • Avishtech, Inc.
  • Besi
  • CALCE (Center for Advanced Life Cycle Engineering)
  • Cargill
  • Celanese International Corporation
  • Celestica
  • Centro Ricerche FIAT S.C.p.A
  • Cimetrix
  • CoreTech System Co., Ltd. (Moldex3D)
  • Dartmouth College
  • Dell, Inc.
  • DELO Industrial Adhesives
  • Delton Technology
  • Dupont
  • ECIA (Electronics Components Industry Association)
  • Extreme Networks
  • FiberQA
  • Foresite, Inc.
  • Foxconn Interconnect Technology, Ltd.
  • Fraunhofer IZM
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  • HP, Inc.
  • IBIDEN CO., LTD.
  • IBM
  • Indium Corporation of America
  • Industrial Technology Research Institute (ITRI)
  • Insidix
  • Integrated Electronics Engineering Center (IEEC), SUNY-Binghamton
  • Integrated Micro-Electronics Inc. (IMI)
  • Intel Corporation
  • Interflux Electronics
  • IPC-Association Connecting Electronics Industries
  • Isola Corp.
  • ITEQ Corporation
  • Jabil
  • John Deere Electronics
  • Keysight Technologies, Inc.
  • Korea Advanced Institute of Science & Technology (KAIST)
  • Kulicke & Soffa Netherlands B.V.
  • Lotes Co. Ltd.
  • MacDermid Alpha Electronics Solutions
  • Makersite
  • MIT Microphotonics
  • MED-EL Elektomedizinische Gerate GmbH
  • Microsoft
  • Mosaic Microsystems
  • Mycronic AB
  • National Institute of Standards and Technology (NIST)
  • Nihon Superior Co., Ltd.
  • Nio
  • Nokia
  • Nordson Electronics Solutions
  • Optica
  • Panasonic
  • Picosun, an Applied Materials Company
  • Plexus Corporation
  • Power Sources Manufacturers Association (PSMA)
  • Purdue University
  • QWED
  • Resonac (Showa Denko)
  • Rochester Institute of Technology
  • SABIC
  • Safran
  • Sekisui Chemical Co., Ltd.
  • SEMI
  • Senju Comtek/Senju Metal Industry Co.
  • Senko Advanced Components
  • Shengyi Technology (SYTECH)
  • Shinko Electric Industries
  • SMTA
  • Suzhou Eunow Co. Ltd.
  • Taiwan Printed Circuit Association (TPCA)
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Whitepapers & Position Statements

iNEMI White Paper on Development of a Methodology to Determine Risk of Counterfeit Use (October 2013)
iNEMI White Paper on Harmonization of Environmental Data Management (December 2012) 
iNEMI White Paper on PVC Alternatives (December 2012)
iNEMI Position Statement on the Limits of Temperature, Humidity and Gaseous Contamination in Data Centers and Telecommunication Rooms to Avoid Creep Corrosion on Printed Circuit Boards (April 2012)
iNEMI Product Carbon Footprint (PCF) Position Statement (October 2010) 
iNEMI Whitepaper on Lifecycle Assessment (April 2010) 
iNEMI Timeline for HFR-Free Electronics & PVC-Free Cabling (February 27, 2010) 
iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)
 


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Upcoming Events

  • 26
    Sep
    CHIPS R&D Standards Summit

    9/26/2023 to 9/27/2023 EDT

  • 26
    Sep
    Packaging Tech Topic Series: Toward the Physical Reliability of 3D-Integrated Systems

    9:00 AM to 10:00 AM EDT

  • 27
    Sep
    iNEMI Keynote at MMA Conference

    8:30 AM to 9:30 AM CET

  • 27
    Sep
    RESCHEDULED: Seminar on Humidity Robustness and Isolation Coordination for e-Mobility

    9:00 AM to 4:30 PM CET

  • 13
    Oct
    iNEMI Workshop: Reliability and Standards for Automotive Electronics

    8:30 AM to 5:30 PM HKT

View All Events

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