Wiring Density for Organic Packaging Substrates
Phase 1 of the Wiring Density Project is complete. This phase consisted of conducting an industry survey on current wiring density, design rule capabilities and a projection of future requirements. The following presentation is a summary of the findings of the survey broken into 5 areas: impact of Si architecture, impact of package architecture, impact of substrate process capability, options for increased wiring density and a technology gap analysis.
Meeting the wiring density needs of the next generation of packaging technology will require improvements in all areas of organic packaging substrates technology. iNEMI's Wiring Density for Organic Packaging Substrates Project surveyed the industry on current wiring density, design rule capabilities and future requirements. Their goal was to get industry feedback on which substrate design features should be included in a roadmap to accurately represent future wiring density needs from the perspective of material set, low-cost lithography/laser, plating, and inspection and test.
Statement of Work and Project Statement
Challenges to Increasing Wiring Density for Organic Packaging Substrates, presented by Masahiro Tsuriya (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 20, 2012)
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