Membership & Benefits
Webinar: Followup to iNEMI Forum at EGG 2016 - November 30
iNEMI Research Webinar: Developing Damage Models for Solder Joints Exposed to Complex Stress States: Influence of Potting, Coating, Mirroring, and Housing - December 8
End-of-Project Webinar: Value Recovery from End-of-Life Electronics - December 14
iNEMI Research Webinar: Fan-out Wafer Level Packaging (FOWLP) - January 12
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International Electronics Manufacturing Initiative
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Herndon, VA 20170-4214
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