Advancing Manufacturing Technology
OUR MISSION:
Forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.
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Roadmap
iNEMI's roadmap provides a 10-year outlook for electronics manufacturing, anticipating technology needs and identifying gaps. It is unique in scope — covering the full supply chain — and is an important tool for focusing R&D priorities.
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Technical Planning
iNEMI’s process of roadmapping, gap analysis and industry input allows us to identify critical technology needs. Our Research Priorities document provides valuable information for academic and industry researchers.
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Deployment Projects
iNEMI’s deployment projects eliminate technology gaps, set direction for future technology, and drive standardization to reduce cost & complexity. These projects leverage the efforts and resources of multiple participants, reducing the risk and cost to any one organization.
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Industry Outreach
iNEMI workshops provide forums for sharing solutions & best practices, prioritizing key challenges, and networking with customers & suppliers. Whitepapers & position papers establish members’ positions on various topics to help accelerate convergence on key issues.
Members
News & Highlights
2021 iNEMI Council of Members Meeting presentation & recording (members only; June 14 & 15)
New iNEMI projects forming:
- Reliability & Loss Properties of Copper Foils in 5G Applications
- Extended Reliability Assessment for Electronics Components
Eco-Design for Circular Electronics Economy Tech Topic Series
5G/mmWave Tech Topic Series
Board Assembly Tech Topic Series
iNEMI Names Shekhar Chandrashekhar CEO (February 25 2021)
iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19 (download paper)
Events
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2Aug
Call for Participation: Extended Reliability Assessment for Electronics Components, Session 1
11:00 AM to 12:00 PM EDT
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3Aug
Call for Participation: Extended Reliability Assessment for Electronic Components, Session 2
9:00 AM to 10:00 AM CDT
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25Aug
Packaging Technology Topic Series: DuPont
9:00 AM to 10:00 AM EDT
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26Aug
End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, S1
9:00 AM to 10:00 AM EDT
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27Aug
End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, S2
10:00 AM to 11:00 AM JST