INEMI Board Assembly Roadmap Webinar
This webinar will review INEMI’s Board Assembly Roadmap, including assembly materials, surface mount technology, rework and repair, press fit, and CPU socket interconnect. It will also highlight next steps and brainstorm future directions for PCB technology. Presenters are Jasbir Bath (Bath Consultancy LLC) and Paul Wang (MiTAC International), co-chairs of the INEMI Board Assembly Roadmap.
About the Webinar
Join us for an INEMI Roadmap webinar focused on Board Assembly — a key element in the electronics manufacturing ecosystem. This session is open to all industry professionals interested in the current and future state of printed circuit board (PCB) technologies.
This engaging session will summarize the current roadmap in this area and explore the emerging technologies and future challenges in PCB assembly. Key topics areas include:
- Assembly materials
- Surface mount technology
- Rework and repair strategies
- Press-fit applications
- CPU socket interconnect solutions
- Strategic next steps in board assembly evolution
The session will also feature an interactive brainstorming session, inviting attendees to share their perspectives and contribute ideas for future directions and emerging challenges in PCB technology.
Whether your expertise lies in design, manufacturing, or materials science, this session provides valuable insight into long-term trends impacting electronics production. Participants will gain a deeper understanding of how industry needs are shifting—and how collaborative input can shape the next iteration of the INEMI Board Assembly Roadmap.
Speakers
Dr. Paul Wang
Vice President of Technology Engineering and Global Quality
MiTAC International Inc.
Dr. Wang has published over 100 technical papers in journals and conferences including Journal of Materials Science, SMTA, IPC/APEX, and IEEE. At MiTAC, he leads global efforts in component engineering, manufacturing technology development, and product reliability across a wide range of electronics including servers, PCs, tablets, and wearables. Dr. Wang holds a Ph.D. in Mechanical Engineering and an MBA in Management Science from SUNY Buffalo.
Jasbir Bath
Owner, Bath Consultancy LLC
With over a decade of involvement in INEMI's Board Assembly Roadmap, Jasbir brings deep industry experience. He previously served as Corporate Lead Engineer at Solectron/Flex and Technical Officer at ITRI. He has authored five books on lead-free soldering and received the SMTA Excellence in Leadership Award and the INEMI Dedicated Service Award. Jasbir holds BS and MS degrees in Materials Science from the University of Manchester, UK.
About the INEMI Roadmap
The INEMI Roadmap provides a comprehensive 10-year outlook on the electronics manufacturing landscape, mapping the evolution of technologies in response to changing market drivers, emerging challenges, and innovations across the value chain.
From component design to system integration and end-of-life, the Roadmap spans the full lifecycle and ecosystem — supporting strategic planning, technology investment, and industry collaboration. Explore the full roadmap.
Don’t miss this opportunity to contribute to the future direction of board assembly technologies. Stay informed. Stay connected. Be part of shaping what's next in electronics manufacturing.
Registration
This webinar is open to industry; advance registration is required. Scroll to the bottom of the page for registration. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. For questions about this session or the INEMI Roadmap, please contact webinar host Francis Mullany ([email protected]), INEMI Director of Roadmapping.
Registration
Registration is closed.