End-of-Project Webinar: Package Warpage Prediction and Characterization, Phase 6: Glass Core Substrates

Advantages of Glass Core Substrates

Glass is emerging as a strong candidate for next-generation electronic packaging thanks to its low coefficient of thermal expansion (CTE), high modulus of rigidity, and excellent electrical performance. These properties enable larger package form factors while supporting much thinner, more stable package stack-ups.

As packaging technologies continue to evolve, dynamic warpage characterization is becoming increasingly critical to ensure seamless board assembly and high manufacturing yield. Understanding the warpage behavior of glass core substrates (GCS) is essential for enabling real-time control and accelerating adoption in future packaging applications.

INEMI has conducted a series of projects focused on package warpage characterization and prediction. The recently completed Phase 6, led by Kang Eu Ong of Intel, expands this work by studying package warpage using glass core substrates and comparing the results to organic materials, which were investigated in Phase 5. 

What You Will Learn

Join this end-of-project webinar to discover how the Phase 6 project team:

• Validated simulation results with physical measurements to accurately characterize dynamic warpage in glass core substrates
• Evaluated how build-up materials influence warpage performance
• Compared warpage behavior of glass core substrates with traditional organic substrate materials
• Combined finite-element modeling with experimental validation to deliver a comprehensive thermomechanical warpage analysis
• Demonstrated how CTE dominates warpage behavior at high temperatures (260°C), while elastic modulus plays a larger role at room temperature

Who Should Attend

This webinar is ideal for:

• Substrate material suppliers
• OSATs and IDMs developing technologies using glass substrate materials
• Researchers and engineers focused on package warpage, reliability, and simulation 

Registration

This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content) on April 21 and 22. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Haley Fu  ([email protected]). 

Session 2

Wednesday, April 22, 2026
10:00-11:00 a.m. EDT (US) 
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Scroll down to register for Session 2

Session 1

Tuesday, April 21, 2026
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (US) / 6:00-7:00 p.m. PDT (US) on Monday, April 20 
Click here to register for Session 1  (scroll to the bottom of the page)