Abstract

Heterogeneous SiP packages are becoming popular as an electronic packaging solution. These packages require finer circuitry patterns designed within the substrate/interposer. Defect inspection and measurement capability using AOI (automatic optical inspection) on fine lines (<10um) and spaces (<10um) on panel-size substrates/interposers impacts yield, throughput, and reliability. At the same time, larger panel size and more layers on substrates demand increased capabilities from AOI equipment to accurately detect, characterize and reject true defects without over-rejections. Finer trace widths and spaces will need better AOI optics that reduce the field of view and depth of focus while addressing warpage issues as well as organic panel shrinkage. 

AOI Inspection and Measurement Study

Phase 4 of INEMI’s Panel Level Package Fine Pitch Substrate Inspection/Metrology Project was launched to characterize the current capabilities of AOI metrologies as well as to understand future trends for AOI measurement and inspection technologies. The project team has designed and fabricated a test vehicle and will be conducting a study to determine AOI inspection capabilities in order to identify any technical difficulties and gaps between current capabilities and user needs. Analysis will include the level of detectability by defect types and defect sizes. 

This webinar will share information about the test vehicle design and the plan for testing. INEMI is looking for industry participation to help compile the data needed for the analysis. We are looking for input from test equipment manufacturers and substrate fabricators, along with package assembly companies and OEMs using advanced packaging technologies.

About the Speaker

Feng Xue is a Senior Technical Staff Member at IBM Systems Supply Chain Engineering. He has 20 years’ experience in semiconductor technology and supply chain operation. In his current role as Chief Architect for Supply Chain Quality System Solutions, he is leading initiatives on internal quality management systems, supplier quality programs, business analytics, app modernization and cloud-native app for quality processes, AI and IIoT solution deployment and Industry 4.0 transformation, engineering skill development and technical leadership development.

Registration

This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Masahiro Tsuriya ([email protected]).