Join INEMI at IPC APEX EXPO
March 18-20, 2025
Anaheim, California

INEMI Staff Attending

We hope to see you at APEX this year. Several INEMI staff will be attending. Click here to schedule a meeting during the conference.

• CEO Shekhar Chandrashekhar

• CTO Grace O’Malley

• Director of Roadmapping Francis Mullany

• Project Manager Emma Hudson (PCB & Laminates projects)

Tuesday, March 18

INEMI Session: INEMI Roadmap Readout and Future Planning Session — PCB and Laminates

Event Type: Special Event
Time: 9:30 a.m. — 12:00 p.m. / Location: 210A
Session chair: Emma Hudson (INEMI)

For our planning purposes, please register for this session.

This session combines information about key technology trends and associated challenges identified in the iNEMI PCB Roadmap with updates from the ongoing iNEMI technical projects addressing some of these challenges. Topics and guest speakers include:

• Introduction to the INEMI Printed Circuit Board Roadmap, Tarja Rapala (EIPC), Co-Chair, INEMI Printed Circuit Board Roadmap  

• Joe Fuller (Intel) — OEM perspective

• Alun Morgan (Ventec) — laminate manufacturer perspective

• Updates from  iNEMI projects

• Reliability & Loss Properties of Copper Foils for 5G Applications, Emma Quinn (IBM)

• PCB Characterization for CAF and ECM Failure Mitigation, Tony Senese (Panasonic) 

• Hybrid PCBs for Next Generation Applications, Sarah Czaplewski (IBM), Project Co-leader

• PCB & Laminates Technology Integration Group (TiG) – areas being considered for new project development, Ed Kelley (Four Peaks Innovation), TIG Chair

• Brainstorming session – Identify gaps and discuss how to improve new product introduction, focusing on the critical challenges of AI-related products

Technical Paper: Reliability and Loss Properties of Copper Foils in 5G Applications 

Presented by: Emma Quinn (IBM) and Dr. Ayman Isaac (Isola Group)
Event Type: Technical Conference Session
S12: High-Frequency, 5G and 6G Applications
Time: 3:30-4:30 p.m. / Location: 303A
INEMI project team: Reliability & Loss Properties of Copper Foils for 5G Applications

Wednesday, March 19

INEMI Session: INEMI Roadmap Readout and Future Planning Session — Board Assembly

Session chair: Francis Mullany, iNEMI Director of Roadmapping
Event type: Special Event
Time: 8:00-10:00 a.m. / Location: 209B

For our planning purposes, please register for this session.

Board assembly is a key step in the manufacture of complex integrated electronic systems. In this session, iNEMI will provide a review of the recently published Board Assembly Roadmap. There will also be a discussion of, and brainstorming on, longer-term trends and technology disruptions in board assembly and associated complex integrated systems. Outputs will be used to shape further iNEMI roadmapping activities in 2025. The session will be moderated by INEMI Director of Roadmapping, Francis Mullany. Topics and guest speakers include:

• INEMI Board Assembly Roadmap Review, Paul Wang Vice President, Technology Engineering and Global Quality, MiTAC International Corporation, and Co-chair of the INEMI Board Assembly Roadmap
• The Future of Electronics Hardware, Srini Aravamudhan, Principal Engineer, Board Assembly Technology Development, Intel
  

The session will end with a discussion of, and brainstorming on, longer-term trends and technology disruptions in board assembly and associated complex integrated systems. Outputs will be used to shape further iNEMI roadmapping activities in 2025.

Technical Paper: Applying Pre-trained ViT Model for PCB & Components Image Recognition at Scale

Presenter: Dr. Mehdi Hamid (IBM)
Event Type: Technical Conference Session
S26: Factory of the Future 4: Simulation and Modeling
Time: 3:30-5:00 p.m. / Location: 303B
INEMI project team: AI Enhancement to AOI for PCBA Project, Phase 2

Technical Paper: Evaluating PCB Fabrication Capabilities for Compliance with SFF-TA-1002 and CEM Connector Specifications

Presenter: Joe Fuller (Intel)
Event Type: Technical Conference Session
S28: Design for High Speed, High Bandwidth and Reliability
Time: 3:30-5:00 p.m. / Location: 304C
INEMI project team: PCB Connector Footprint Tolerance