Grenoble, France | September 9, 2013

Session 1:  Welcome

1.1 Introduction — Bill Bader, CEO, INEMI

1.2 Automotive Electronics:  Perspectives on the Next Decade — Dr. Egil Juliussen, Principal Analyst-Infotainment & ADAS, IHS Automotive (market trends)

1.3 The EPoSS Strategic Research Agenda on Smart Systems Integration — Dr. Riccardo Groppo, Chair of the EPoSS Automotive Working Group and CEO of Ideas & Motion

Session 2:  Electronic Manufacturing Challenges

2.1 Automotive Electronic Manufacturing Technology Roadmap — Mr. Galen Reeder, Operations Director for Delphi Electronics and Safety, North & South America

2.2 Manufacturing Transformation — Dr. Roberto Lu, Vice President, Technology, Advanced Manufacturing, TE Connectivity

2.3 New Electronics Testing Challenges for the Future Mobility — Mr. Matteo Fioravanti, Manager of the Electronics Engineering Department, Loccioni Mobility

Session 3:  Challenges in the Industry - Supplier Perspectives

3.1 High Reliability in Automotive Materials Challenges — Rodrigo Aguilar, Marketing Manager, Inventec Performance Chemicals

3.2 The Continuing Revolution in Automotive Electronics - From the Beginning to the Future — Dr. Bill Bottoms, Chairman, 3MTS, and Chair of the ITRS Assembly & Packaging Technical Working Group and the INEMI Packaging & Component Substrates Technology Working Group

3.3 Recent Packaging and Board Assembly Challenges for High-Reliability Applications — Dr. Bart Vandevelde, Team Leader, Center for Electronics Design & Manufacturing, imec

Outcomes: Break-Out Groups
Reports from break-out group sessions

For further information:

Grace O'Malley
[email protected]