Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature, Richard Coyle, PhD, Nokia Bell Labs,  

LTS1: Thermal Fatigue and Mechanical Shock Reliability of LTS Solder Joints, SMTA International, October 23, 2024, Rosemont, Illinois USA 

Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints, Prabjit Singh, Ph.D., IBM Corporation, LTS2: Electromigration in Tin-Bismuth Solders, SMTA International, October 24, 2024, Rosemont, Illinois USA 

INEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond, Paul Wang, Ph.D., MiTAC Computer Technology, MFX2: Large Panel Assembly, SMTA International, October 22, 2024, Rosemont, Illinois USA 

The Effect of Thermal Cycling Dwell Time on Reliability of High-Performance Pb-free Solder Alloys, Richard Coyle, Ph.D., Nokia Bell Labs, RHE1: Solder Joint Reliability, SMTA International, October 22, 2024, Rosemont, Illinois USA 

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability, Richard Coyle, Ph.D., Nokia Bell Labs, RHE4: Thermal Shock & Thermal Cycle Testing Comparisons SMTA International, October 22, 2024, Rosemont, Illinois USA