INEMI Meeting:
   Optical Device Inspection & Cleaning Program
   Connector Particles Thickness Project

Agenda, Introductions and INEMI Overview
David Godlewski, INEMI

Project Background and SOW - “Connector Particles Thickness Project”
Tatiana Berdinskikh, Celestica International Inc.

Semi-Controlled Contamination Method for Optical End-Faces
David Lach, Tellabs Operations Inc.

Design of Experiment for Particle Thickness – Project Status Update
David Fisher, Tyco Electronics
      
Connector Separation Experimental Design
Doug Wilson, PVI Systems

Fixed Attenuation Airgap Interface for a Multimode Optical Fiber Interconnection
Mark Marino, Juniper Networks

Assembly and Inspection Process
Timothy Buelow, Plexus

Manufacturing Concerns on Cleanliness of Lens-Based Transceivers
Ed Stuart, Cisco Systems (check back for presentation)
                                  
Effects of Non-Contact Lens Contamination on Multi-Mode Optical Transmission
Glenn Victor, Oplink

Development of Cleanliness Specification of Receptacle Transceivers: Fiber Stub
Ryo Nagase, Chiba University, Japan

Automated Inspection and Cleaning System
Doug Wilson, PVI Systems

Development of a Dry Fabric Cleaner for Miniature Parallel Optical Interface Connector PRIZM
Toshiaki Satake, US Conec

Roadmap Gap Analysis Plan
David Godlewski, INEMI

For further information, contact:

David Godlewski
[email protected]
1 717-651-0522