Advanced Packaging Tech Topic Series
Call-for-Participation: Package Warpage Prediction and Characterization Project, Phase 6 (January 10, 2023) Project page
SMTA Wafer-Level Packaging Symposium; February 14-16, 2023 / Fremont, California
“RDL Adhesion Study for Advanced Packages,” Steven Martell (Nordson), Wafer-Level Packaging Symposium, Session 2: Advanced Manufacturing and Test / Test Metrology for Advanced Manufacturing (February 14, 2023: Fremont, California) (Available to members only; requires log-in). INEMI project: RDL Adhesion Strength Measurement
"INEMI Advanced Packaging Roadmapping and Challenges Ahead,” Shekhar Chandrashekhar (INEMI) and Dan Gamota (Jabil), Wafer-Level Packaging Symposium, Session 6: Wafer-Level Packaging / Novel WLP Technology Roadmap and Dielectric Systems, February 16, 2023; Fremont, California.
“Advanced Packaging — the Need for Standards,” Shekhar Chandrashekhar (INEMI), International Semiconductor Executive Summit/ISES USA, March 7, 2023; Chandler, Arizona
Call-for-participation: Low-Temperature Materials for First Level Interconnect (April 12 & 13, 2023)
Project page
2023 International Conference on Electronics Packaging (ICEP); April 19, 2023; Kyushu, Japan
“AOI Pattern Detection Study for Fine Pitch Advanced Substrate,” Feng Xue (IBM), Session WA1: INEMI Session, 2023 International Conference on Electronics Packaging (ICEP), April 19, 2023; Kyushu, Japan (INEMI members only)
INEMI project: Fine Pitch Circuit Pattern Inspection/Metrology, Phase 4
“Copper Trace Adhesion Measurement Study for Advanced Substrate Circuitry Patterns,” Masahiro Tsuriya (INEMI), Session WA1: INEMI Session, 2023 International Conference on Electronics Packaging (ICEP), April 19, 2023; Kyushu, Japan (INEMI members only)
INEMI project: RDL Adhesion Strength Measurement
“An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305,” Sze Pei Lim (Indium Corporation), Session WA1: INEMI Session, 2023 International Conference on Electronics Packaging (ICEP), April 19, 2023; Kyushu, Japan (INEMI members only)
INEMI project: Panel Level Package Fine Pitch Substrate Inspection/Metrology, Phase 4
“Adhesion Testing of Fine Line Patterns in Integrated Packages,” Frank Wang (Unimicron Technology Corp.), INEMI Session, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), October 25, 2023; Taipei, Taiwan (INEMI members only)
INEMI project: RDL Adhesion Strength Measurement