“Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films,” Ian Chin (Intel), Wei Keat Loh, Seow Chien Kee and Yi He (all of Intel), Zulkifly Abdullah (Universiti Sains Malaysia), and Masahiro Tsuriya, (INEMI project manager), ASME’s Journal of Electronics Packaging online, August 24, 2024. (Will be included in the March 2025 edition of the print publication.)

This article is based on information from INEMI’s Moisture Induced Expansion Metrology for Packaging Polymetric Materials Project