Taipei, Taiwan | October 22, 2015

Welcome and INEMI 2015 Highlights
Haley Fu, INEMI

Innovation from Asia:  Scoping New INEMI Package Projects
Yoshihiro Tomita, Intel K.K.

Characterization of Pb-Free Alloy Alternatives
Ningcheng Lee, Indium

Creep Corrosion Failure Analysis on ENIG Printed Circuit Boards
Dem Lee, iST

Recent Trends of Organic Package Warpage
Masahiro Tsuirya, INEMI