Cambridge, UK | May 26, 2011

Grace O’Malley (INEMI) delivered the keynote address at the NMI (National Microelectronics Institute) IC Packaging Innovation forum at TWI in Cambridge, UK, on May 26, “Technology Trends & Roadmaps for Package Innovation."  This presentation highlighted the findings of the Packaging and Component Substrates chapter of the 2011 INEMI Roadmap.