Technology Roadmap Overviews and Future Direction through Technology Gaps 
Chuck Richardson, Masahiro Tsuriya, and Haley Fu (INEMI)
paper  

Relative Humidity Dependence of Creep Corrosion on Printed Circuit Boards
Prabjit Singh and Larry Palmer (IBM), Dem Lee and Jeffrey Lee (IST-Integrated Service Technology), Karlos Guo and Julie Liu (Lenovo), Simon Lee and Geoffrey Tong (Dow Chemical Company), Chen Xu and Debbie Fleming (Nokia), and Haley Fu (iNEMI)
paper
presentation

Inspection/Metrology Benchmarking on Fine Pitch Design Substrate for Advanced Packages
Feng Xue, Charles Reynolds, Thomas Wassick and Glenn Pomerantz (IBM), Hiroyuki Watanabe (Ibiden), Cindy Han (Wistron Corp.), Masahiro Tsuriya (iNEMI)
paper
presentation

High-Temperature Pb-Free Die Attach Material Project, Phase 1: Survey Results
Lim Sze Pei and Hongwen Zhang (Indium Corp.), Binghua Pan (Delphi Automotive Systems), Wayne Ng (Nihon Superior Co.), Bosgum Wu (Wistron Corp.), Kim S. Siow (Universiti Kebangsaan Malaysia), Sayalee Sabne (Flex), and Masahiro Tsuriya (INEMI)
paper
presentation

As published in the ICEP 2017 Proceedings.