These papers were originally published in the proceedings of the SMTA International, October 9 - October 12, 2023
Minneapolis, MN USA

Tuesday, October 10

Session IRR1: Programs Addressing High Reliability and Mission Critical Applications Interconnect Research and Reliability (IRR)
“A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys,” Richard Coyle, PhD, Nokia Bell Labs
INEMI project: Characterization of Third Generation High-Reliability Pb-Free Alloys

Wednesday, October 11

Session LTS1: Thermal Cycling Performance of LT Sn-Bi Solder Joints with and without Aging Low Temperature Solder
“The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects,” Dan Burkholder and Raiyo Aspandiar, Ph.D., Intel Corporation; presented by Raiyo Aspandiar
INEMI project: BiSn-Based Low-Temperature Soldering Process and Reliability

Session LTS3: Electromigration, Shear and Drop Shock Assessment of Low Temperature Sn-Bi Solder Joints
“Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints,” Prabjit Singh, Ph.D., IBM Corporation
INEMI project: Electromigration of SnBi Solder for Second-Level Interconnect