Wei Keat Loh
Director of Core Competencies and Site Manager for 
Assembly & Test Technology Development (ATTD) in Malaysia
Intel Corporation

Wei Keat has been engaging with INEMI for more than 12 years, during which time he has chaired several INEMI projects and is the current chair of INEMI Packaging Technology Integration Group (TIG). He has helped INEMI identify key players and needed capabilities to accomplish project goals and eliminate technology gaps, leading to project achievements and outputs that are recognized and referenced by the electronics industry. He encourages the participation of young engineers and helps them grow in leadership and industry recognition. Wei Keat is also active in industrial events and conferences, where he promotes INEMI’s roadmaps and projects and demonstrates the value of collaboration. 

Packaging TIG Leadership

Wei Keat joined the Packaging TIG in 2014 and became chair in 2018. Under his leadership, Packaging has become one of the most active INEMI TIGs with industry webinars, technical forums, conference engagements and ongoing development of relevant projects to meet member needs. Working with INEMI staff members Tsuriya-san and Haley Fu, Wei Keat helped establish and continues to drive the monthly INEMI Packaging Tech Topic Series — a series of webinars that are open to industry. This program has helped raise awareness of INEMI efforts and collaboration opportunities. 

Wei Keat has contributed to each Packaging Technical Plan since 2017 and is now working on the 2024 plan. In 2020, he helped revamp documentation Technical Plan to make the easier to update and maintain.

INEMI Project Leadership

Wei Keat has made significant contributions to INEMI programs by sharing his skills and knowledge as well as resources. As a project leader, he is adept at pacing the team’s work in a meaningful and collaborative way without adding tension and stress within the member organizations. He also leverages his networks to broaden INEMI communications and reach. 

He has led or been involved in multiple INEMI projects on package warpage, including the multi-phase Package Warpage Prediction and Characterization projects which span more than 12 years. This series of projects addresses future package warpage challenges including measurement, modeling, and material development. The projects have generated significant data on package warpage and published nine conference papers in a yearly cadence, some of which were recognized as Best Papers. Phase 5 of the project received an INEMI Project Leadership Award in 2022.

In addition to the warpage-related projects, Wei Keat has helped drive further collaboration among INEMI members to address gaps in the application of low-temperature solder on both first- and second-level interconnect, revisit reliability assessment for first-level interconnect solder voids, investigate adhesion strength of laminates, explore new metrology on moisture induced polymeric expansion, along with other potential research topics.