INEMI Presentations at SMTAI 2019

SMTA International 2019
September 22-26
Rosemont, Illinois USA

 

The papers listed below were originally published in the SMTA International Conference Proceedings 2019 and are included here with permission from SMTA.

Thursday, September 26 

Session LF 1 - Lead-Free Reliability Challenges 

Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys
Presenter: Richard Coyle (Nokia Bell Labs)  
download:   paper    

Session MFX 7 - Cleaning Challenges

Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies — INEMI Cleanliness Research Study
Presenter: Mike Bixenman (KYZEN Corporation)
download:  paper   presentation

Session LF 3 - Low Temperature Solder

INEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part VI: Post Mechanical Shock Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components
Presenter: Raiyo Aspandiar (Intel Corporation)
download:   paper    presentation