Outstanding Technical Paper Award Presented to Two INEMI Papers at ICEP

The Japan Institute of Electronics Packaging (JIEP) presented two INEMI projects with Outstanding Technical Paper Awards at the International Conference on Electronics Packaging (ICEP).

The two papers were featured in the ICEP 2022 technical program and awards were presented at this year's conference (ICEP 2023). Congratulations to both project teams and the authors. Download these and other INEMI papers from ICEP 2022.   

“Novel Method for Measuring High Temperature Hygroscopic Swelling”
Project: Moisture Induced Expansion Metrology for Packaging Polymetric Materials
Authors:

• Ian Chin, Intel Microelectronics (presenter)
• Wei Keat Loh, Intel Microelectronics
• Bin Abdullah, Universiti Sains Malaysia 

“Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability”
Project: 1st Level Interconnect Void Characterization 
Authors:

• Kor Oon Lee, Intel Corporation (presenter)
• Kiyoshi Oi, Shinko Electric Industries Co. Ltd
• Sze Pei Lim, Indium Corporation
• Yvonne Yeo, IBM Corporation
• Keith Sweatman, Nihon Superior Co. Ltd
• Toshiaki Ono, Nordson Test & Inspection
• Kei Murayama, Shinko Electric Industries Co. Ltd
• Steven R. Martell, Nordson Test & Inspection
• Haruo Shimamoto, AIST
• Masahiro Tsuriya, INEMI