INEMI Session at iMAPS 19th International Conference & Exhibition on Device Packaging

INEMI Invited Session / Session A3: Next Gen Applications Track 
5G/6G Roadmap Creation and Packaging Challenges
Chair: Urmi Ray
March 14, 2023
Fountain Hills, Arizona USA

 
 
5G/6G mmWaveMaterials and Electrical Test Technology Roadmap (5G/6G MAESTRO)
Urmi Ray, INEMI
 

6G Hardware System Design and Packaging Needs
Prof Markondeyaraj Pulugurtha, presenter
Satheesh Bojja Venkatakrishnan, John Volakis
Florida International University 
 

5G/6G MAESTRO Materials: Glass Substrates for mmWave/sub-THz Applications
Presented by Shelby Nelson (for Paul Ballentine), Mosaic Microsystems 
 
5G Electronics: Bridging the Measurement Challenges    
Lucas Enright, NIST