High-Temperature, Pb-free Die-Attach Material

End-of-Project Webinar

Click here to download presentation (March 23, 2017).
This webinar was open to members and non-members. 

 

Statement of Work and Project Statement

Statement of Work (Version 1.0; March 23, 2016)
Project Statement (Version 1.0; March 23, 2016)

 

Presentation

Call for Participation Webinar Presentation (April 14, 2016)

 

Background

• There is no single identified drop-in solution for high-temp Pb-free material for die-attach that can replace current high Pb options.
• Higher junction temperature for under-the-hood automotive application requires higher reliability alloys which can fulfill the stringent TCT requirement.

 

Purpose of Project

• The purpose of this project is to assess the processability and reliability of different Pb-free materials available for power semiconductor die-attach application on leadframe or ceramic substrate, which is using Pb-containing material currently. This is one of the challenges in material identified in 2013 INEMI Packaging Technology Roadmap chapter.
• This project is phased approaches. Phase 1 is to conduct the benchmarking on the technology or material availability and trends with current POR material and process. Phase 2 is to perform the experiment to ensure the reliability performances by selecting the material candidates.
• The anticipated benefits are to provide the various options of material solutions from the two phased projects.
• Application targets – Power MOSFET, IGBT modules, Integrated Power modules.

 

Further Information

Masahiro Tsuriya
[email protected]

Project Leaders

Sze Pei Lim, Indium

Binghua Pan, Delphi