Warpage Characteristics of Organic Packages, Phase 1: Package Warpage Qualification Criteria

Problem Statement & Statement of Work

• Current standard is not adequate to predict good yield results at 1st and 2nd level assembly
• Measurement methods (dimensional and test) not common

Statement of Work - Package Qualification Criteria to Ensure Acceptable Warpage Performance for 2nd Level Assembly (Version 3.0; September 21, 2010)
Note:  this project is the first phase of what later became known as the Warpage Characteristics of Organic Packages projects.

Objectives

• Define the qualification method and criteria, e.g., sample size, precondition, variations of material and processes (1st and 2nd level)
• Establish measurement methods
• Expected output
• Procedure and criteria reference for OEM and suppliers

Related Projects

• Warpage Characteristics of Organic Packages, Phase 2
•  Warpage Characteristics of Organic Packages, Phase 3
•  Warpage Characteristics of Organic Packages, Phase 4
•  Package Warpage Prediction and Characterization, Phase 5: Organic Substrates
•  Package Warpage Prediction and Characterization Project, Phase 6: Glass Core Substrates

For Additional Information

Project Leaders

Wei Keat Loh, Intel

Robert Carson, Cisco