System Integration

Scope

Investigate and enable deployment of advanced materials, components and processes to support high-volume manufacturing capabilities and meet desired performance requirements..

Drivers

Miniaturization, cost, form factor, reliability, lack of standards for new applications.

Related Projects

1st Level Interconnect Void Characterization, Phases 1 & 2 - Completed

5G Test Methodology Challenges - In Development

5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO) - Completed

5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO) - Completed

5G/mmWave Materials Assessment and Characterization - Completed

Adhesives Characterization for Optical Packaging Project (ACOP) - In Progress

AI Enhancement to AOI for PCBA Project - Completed

Alternative Materials Assessment - Completed

Back End Commonality for Advanced Packaging Large Form Factor Project - Completed

Best Practices for Expanded Beam Connectors in Data Centers - In Progress

BiSn-Based Low-Temperature Soldering Process and Reliability, Phase 3b - In Progress

BiSn-Based Low-Temperature Soldering Process and Reliability, Phases 1-3a - Completed

BiSn-Based Low-Temperature Soldering Process and Reliability, Phases 1-3a - Completed

Characterization of Pb-Free Alloy Alternatives, Phase 1 - Completed

Characterization of Third Generation High-Reliability Pb-Free Alloys - In Progress

Conformal Coating Evaluation for Improved Environmental Protection, Phase 1 - Completed

Conformal Coating Evaluation for Improved Environmental Protection, Phase 2 - Completed

Conformal Coating Evaluation for Improved Protection against Corrosive Environments, Phase 3 - In Progress

Connector Reliability Test Recommendations - Completed

Connector Reliability Test Recommendations, Phase 2 - Completed

Connector Reliability Test Recommendations, Phase 3 - Completed

Copper Wire Bonding Reliability, Phases 1 & 2 - Completed

Counterfeit Components - Assessment Methodology and Metric Development - Completed

Counterfeit Components: Counterfeit Management & Best Practices - Completed

Counterfeit Components: Emerging Trends in Counterfeit Detection & Mitigation - Completed

Counterfeit Components: Size & Breadth of Counterfeiting Risks - Completed

Creep Corrosion: Investigation of Factors that Influence Creep Corrosion - Completed

DC-DC Power Module, Phase 1 (Technical Specification Development) - Completed

DC-DC Power Module, Phase 2 (Prototyping and Testing) - Completed

Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 1 - Completed

Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 2 - Completed

Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 3 - Completed

Eco Design for Circular Electronics Economy - Completed

Eco-Impact Estimator, Phase 3 - Completed

Eco-Impact Estimator, Phase 4 - In Development

Eco-Impact Evaluator for ICT Equipment Project, Phase 1 - Completed

Eco-Impact Evaluator for ICT Equipment, Phase 2 (LCA Estimator Tool Development) - Completed

Electromigration of SnBi Solder for Second-Level Interconnect, Phase 1 - In Progress

Electromigration of SnBi Solder for Second-Level Interconnect, Phase 2 - In Progress

Electronic Product Dataset Project - In Progress

Environmentally Sustainable Electronics TIG - Completed

Extended Reliability Assessment for Electronic Components - Completed

Extended Reliability Assessment for Electronic Components, Phase 2 - In Development

Fiber Connector End-Face Inspection, Phases 1 & 2 - Completed

Final Assembly Automation and Optimization - Completed

Fine Pitch Circuit Pattern Inspection/Metrology, Phase 1 - Completed

Harsh Use Conditions Task Force: Considerations for Advanced Packaging in Harsh Environments - In Progress

HFR-Free High-Reliability PCB - Completed

HFR-Free Leadership Program - Completed

HFR-Free PCB Material Evaluation Project - Completed

HFR-Free PCB Materials, Phase 2 - Completed

HFR-Free Signal Integrity, Phase 2 - Completed

High Density Interconnect Socket Warpage Prediction and Characterization, Phase 1 - Completed

High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2 - Completed

High-Temperature, Pb-free Die-Attach Material - Completed

Hybrid PCBs for Next Generation Applications - In Progress

Impact of Low CTE Mold Compound on Second-Level Board Reliability Project, Phase 2 - In Progress

Impact of Voiding on Thermal Performance of Bottom Terminated Performance (BTCs) - In Development

Improving UL Certification of Laminates and PCBs - Completed

INEMI LCA Estimator Discussion and Q&A Session (members only) - Completed

INEMI Projects on Creep Corrosion - Completed

INEMI Tin Whiskers Projects - Completed

INEMI-IPSR Board-Level Optical Interconnect Project, Phase 1 - Completed

INEMI-IPSR Board-Level Optical Interconnect, Phase 2 (Expanded-Beam Module Interface) - Completed

Lead-Free Assembly Project - Completed

Low CTE Mold Compound on Second-Level Solder Joint Reliability Project, Phase 1 - Completed

Low Temperature Material Discovery and Characterization for First Level Interconnect - In Progress

mmWave Permittivity Reference Material Development - Completed

Module with Separable Single-Mode Expanded-Beam Optical Interface for Edge-Coupled PIC Optics - Completed

Moisture Induced Expansion Metrology for Packaging Polymetric Materials Project, Phase 1 - In Progress

New Packaging Technology Qualification Methodology - Completed

Non-Physical Data Destruction for Enterprise Storage - Completed

Optical Device Inspection & Cleaning Program Connector Particle Tickness Investigation, Phase 1 - Completed

Package Warpage Prediction and Characterization Project, Phase 6 - In Progress

Package Warpage Prediction and Characterization, Phase 5 - Completed

Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4 - In Progress

Pb-Free Alloy Alternatives - Completed

Pb-Free BGAs in SnPb Assemblies Project - Completed

Pb-Free Component & Board Finish Reliability - Completed

Pb-Free Early Failure, Phase 2 - Completed

Pb-Free Nano-Solder Project - Completed

Pb-Free Rework Optimization Project - Completed

Pb-Free Rework Optimization, Phase 3 - Completed

PCB Characterization for CAF and ECM Failure Mitigation - In Progress

PCB Connector Footprint Tolerance - Completed

PCB Immersion Cooling - In Development

PCB Warpage Characterization and Minimization Project - Completed

PCB/PCBA Material Characterization for Automotive Harsh Environments - Completed

PCBA Cleanliness - Completed

PCBA Materials for Harsh Environments, Phase 2 - In Progress

PCBA Reliability Qualification Project - Completed

Primary Factors in Component Warpage - Completed

PVC Alternatives - Completed

QFN Package Board Level Reliability - In Progress

Qualification Test Development for Creep Corrosion, Phase 1 - Completed

Qualification Test Development for Creep Corrosion, Phase 2 - Completed

Qualification Test Development for Creep Corrosion, Phase 3: The Effect of Relative Humidity on Cree - Completed

Rare Earth Metals Assessment & Supply Chain Actions - Completed

RDL Adhesion Strength Measurement, Phase 1 - Completed

RDL Adhesion Strength Measurement, Phase 2 - In Progress

Reliability & Loss Properties of Copper Foils for 5G Applications - Completed

SiP Module Moldability - Completed

Smart Manufacturing Data Management Best Practices for PCB Assembly - Completed

Solder Paste Deposition Project - Completed

Strain Guidance for PCBAs - Completed

Test Strategy Project - Completed

Thermal Interface Material Performance Characterization Methodology, Phase 1 - In Development

Tin Whiskers Project, Phase II - Completed

Ultra Low Loss Laminate/PCB for High Reliability and Performance Project - Completed

Unified Equipment Interaction Management - Completed

Vertical Farming/Manufacturing - Completed

Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2 - Completed

Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3 - Completed

Wafer/Panel Level Package Flowability and Warpage - Completed

Warpage Characteristics of Organic Packages, Phase 1 (Package Warpage Qualification Criteria) - Completed

Warpage Characteristics of Organic Packages, Phase 2 - Completed

Warpage Characteristics of Organic Packages, Phase 3 - Completed

Warpage Characteristics of Organic Packages, Phase 4 - Completed

Warpage Characterization and Management Program - In Progress

Wiring Density for Organic Packaging Substrates - Completed

Related Roadmap Topics

In Development

High-Performance and Cloud Computing Applications
mmWave Applications